{ "schema": "5lc-selection-review/1", "sublayer": "packaging", "asOf": "2026-10-21", "status": "source-and-calculation-reviewed; representative set with unresolved cutoff", "scope": "Commercial semiconductor assembly and integration: foundry-integrated advanced packaging, merchant logic and memory back-end services, IC substrates and assembly/bonding equipment. Wafer preparation, test-only services and raw package materials remain adjacent screened functions; the selected set does not claim complete coverage of every upstream input.", "commercialEligibility": "Evidence of current manufacturing, commercial products, recognized activity or documented delivered systems. Orders, qualification, announced plants and R&D roadmaps are distinct. Public/private status is irrelevant to eligibility. Consolidate controlled operating units within an economic group.", "predefinedFunctions": [ { "id": "foundry-integration", "minimum": 1, "reason": "Represents integration at the wafer foundry." }, { "id": "logic-assembly", "minimum": 3, "reason": "Three large measured independent outsourced assemblers." }, { "id": "memory-assembly", "minimum": 1, "reason": "Separates memory-specific back-end and module work." }, { "id": "substrates", "minimum": 3, "reason": "Represents the wiring substrates that connect packaged chips." }, { "id": "bonding-equipment", "minimum": 2, "reason": "Represents commercial assembly equipment and distinct bonding processes." } ], "universe": [ { "companyId": "tsmc", "name": "Taiwan Semiconductor Manufacturing Company Limited", "functions": [ "foundry-integration" ], "eligibility": "commercial-current", "evidence": [ "packet:tsmc" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "samsung-electronics", "name": "Samsung Electronics Co., Ltd.", "functions": [ "foundry-integration" ], "eligibility": "commercial-current", "evidence": [ "packet:samsung-electronics" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "intel", "name": "Intel Corporation", "functions": [ "foundry-integration" ], "eligibility": "commercial-current", "evidence": [ "packet:intel" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "ase", "name": "ASE Technology Holding Co., Ltd.", "functions": [ "logic-assembly" ], "eligibility": "commercial-current", "evidence": [ "packet:ase" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "amkor", "name": "Amkor Technology, Inc.", "functions": [ "logic-assembly" ], "eligibility": "commercial-current", "evidence": [ "packet:amkor" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "jcet", "name": "JCET Group Co., Ltd.", "functions": [ "logic-assembly" ], "eligibility": "commercial-current", "evidence": [ "packet:jcet" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "tongfu", "name": "Tongfu Microelectronics Co., Ltd. (通富微电子股份有限公司)", "functions": [ "logic-assembly" ], "eligibility": "commercial-current", "evidence": [ "packet:tongfu" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "powertech", "name": "Powertech Technology Inc. (力成科技股份有限公司)", "functions": [ "memory-assembly" ], "eligibility": "commercial-current", "evidence": [ "packet:powertech" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "unimicron", "name": "Unimicron Technology Corp. (欣興電子股份有限公司)", "functions": [ "substrates" ], "eligibility": "commercial-current", "evidence": [ "packet:unimicron" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "semco", "name": "Samsung Electro-Mechanics Co., Ltd.", "functions": [ "substrates" ], "eligibility": "commercial-current", "evidence": [ "packet:semco" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "ibiden", "name": "IBIDEN CO., LTD.", "functions": [ "substrates" ], "eligibility": "commercial-current", "evidence": [ "packet:ibiden" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "ats", "name": "AT & S Austria Technologie & Systemtechnik Aktiengesellschaft", "functions": [ "substrates" ], "eligibility": "commercial-current", "evidence": [ "packet:ats" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "asmpt", "name": "ASMPT Limited", "functions": [ "bonding-equipment" ], "eligibility": "commercial-current", "evidence": [ "packet:asmpt" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "besi", "name": "BE Semiconductor Industries N.V.", "functions": [ "bonding-equipment" ], "eligibility": "commercial-current", "evidence": [ "packet:besi" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "disco", "name": "DISCO Corporation", "functions": [ "wafer-preparation" ], "eligibility": "commercial-current", "evidence": [ "packet:disco" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "guc", "name": "Global Unichip Corp.", "functions": [ "design-enablement" ], "eligibility": "commercial-current", "evidence": [ "packet:guc" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "applied-materials", "name": "Applied Materials, Inc.", "functions": [ "process-equipment" ], "eligibility": "commercial-current", "evidence": [ "packet:applied-materials" ], "disposition": "Current reviewed commercial role; inclusion and comparison boundaries are evaluated separately." }, { "companyId": "shinko", "name": "Shinko Electric Industries", "functions": [ "substrates", "logic-assembly" ], "eligibility": "commercial-current", "evidence": [ "shinko-products", "shinko-history", "shinko-profile" ], "disposition": "Relevant challenger; latest comparable activity is unknown, not zero." }, { "companyId": "kinsus", "name": "Kinsus", "functions": [ "substrates" ], "eligibility": "commercial-current", "evidence": [ "kinsus-deck" ], "disposition": "Relevant challenger; latest comparable activity is unknown, not zero." }, { "companyId": "nanya-pcb", "name": "Nan Ya Printed Circuit Board", "functions": [ "substrates" ], "eligibility": "commercial-current", "evidence": [ "nanya-pcb-roadmap" ], "disposition": "Relevant challenger; latest comparable activity is unknown, not zero." }, { "companyId": "hanmi", "name": "Hanmi Semiconductor", "functions": [ "bonding-equipment" ], "eligibility": "commercial-role-reported; direct issuer retrieval blocked", "evidence": [ "hanmi-contract-report" ], "disposition": "Relevant challenger; latest comparable activity is unknown, not zero." }, { "companyId": "resonac", "name": "Resonac", "functions": [ "package-materials" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "historical-pool" ], "disposition": "Original broader pool; current packaging-material accounts require fresh role-specific review before numerical comparison. Not assigned an observed score or confirmed current rank." }, { "companyId": "ajinomoto-abf", "name": "Ajinomoto Fine-Techno / Ajinomoto", "functions": [ "package-materials" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "historical-pool" ], "disposition": "Original broader pool; ABF material role, parent food revenue invalid. Consolidate with parent if selected. Not assigned an observed score or confirmed current rank." }, { "companyId": "kyec", "name": "King Yuan Electronics", "functions": [ "test-services" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "historical-pool" ], "disposition": "Original broader pool; test-only role adjacent to assembly. Current comparable accounts not reconstructed here. Not assigned an observed score or confirmed current rank." }, { "companyId": "huatian", "name": "Huatian Technology", "functions": [ "logic-assembly" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional OSAT screening candidate; current primary-role evidence and accounts remain unestablished in this review. Not assigned an observed score or confirmed current rank." }, { "companyId": "hana-micron", "name": "Hana Micron", "functions": [ "memory-assembly" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional memory-assembly candidate; no fabricated AI-specific scale. Not assigned an observed score or confirmed current rank." }, { "companyId": "chipmos", "name": "ChipMOS", "functions": [ "memory-assembly" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional assembly/test candidate; current ranking input not established. Not assigned an observed score or confirmed current rank." }, { "companyId": "chipbond", "name": "Chipbond", "functions": [ "logic-assembly" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional specialist assembly/test candidate; display-driver scope requires AI relevance review. Not assigned an observed score or confirmed current rank." }, { "companyId": "simmtech", "name": "Simmtech", "functions": [ "substrates" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional memory substrate candidate; a separately comparable current measure is unavailable. Not assigned an observed score or confirmed current rank." }, { "companyId": "lg-innotek", "name": "LG Innotek", "functions": [ "substrates" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional substrate candidate; broad camera-module revenue is invalid. Not assigned an observed score or confirmed current rank." }, { "companyId": "hanwha-semitech", "name": "Hanwha Semitech", "functions": [ "bonding-equipment" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional HBM bonding-equipment challenger; no unverified market-share figure used. Not assigned an observed score or confirmed current rank." }, { "companyId": "ev-group", "name": "EV Group", "functions": [ "bonding-equipment" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Private bonding-equipment screening candidate; no private-company zero or funding proxy. Not assigned an observed score or confirmed current rank." }, { "companyId": "suss", "name": "SUSS MicroTec", "functions": [ "bonding-equipment", "process-equipment" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional process and temporary-bonding candidate; function overlaps do not establish substitution. Not assigned an observed score or confirmed current rank." }, { "companyId": "kulicke-soffa", "name": "Kulicke & Soffa", "functions": [ "bonding-equipment" ], "eligibility": "screening-candidate; current evidence incomplete", "evidence": [ "industry-function-screen" ], "disposition": "Additional commercial assembly-equipment screening candidate; financial boundary requires current review. Not assigned an observed score or confirmed current rank." }, { "companyId": "spil", "name": "spil", "functions": [], "eligibility": "consolidated-with-economic-group", "evidence": [ "packet:ase" ], "disposition": "Not an additional independent slot; consolidate with ase." }, { "companyId": "greatek", "name": "greatek", "functions": [], "eligibility": "consolidated-with-economic-group", "evidence": [ "packet:powertech" ], "disposition": "Not an additional independent slot; consolidate with powertech." }, { "companyId": "tera-probe", "name": "tera-probe", "functions": [], "eligibility": "consolidated-with-economic-group", "evidence": [ "packet:powertech" ], "disposition": "Not an additional independent slot; consolidate with powertech." }, { "companyId": "tsmc-advanced-packaging", "name": "tsmc-advanced-packaging", "functions": [], "eligibility": "consolidated-with-economic-group", "evidence": [ "packet:tsmc" ], "disposition": "Not an additional independent slot; consolidate with tsmc." } ], "universeConstruction": { "method": "Begin with the old 19-name pool, map functional boundaries, add Ibiden, private Shinko, current foundry parents and additional specialists before allocating slots. Prior inclusion does not confer eligibility or priority.", "historicalPoolSize": 19, "currentRows": 38, "limitations": "Screening is not an exhaustive market census. Thirteen additional candidates retain explicit incomplete-current-evidence status; their missing observations are not a proof that they are unimportant. High-priority unresolved challengers remain visible at the cutoff." }, "observations": [ { "companyId": "ase", "metric": "External packaging plus testing revenue", "value": 438630.822, "currency": "TWD", "scale": 1000000.0, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "380242.822+233074-174686", "rawInputs": { "FY2025": 380242.822, "H1_2026": 233074, "H1_2025": 174686 }, "sourceIds": [ "ase:ase-20f-2025", "ase:ase-q226-wire" ], "boundary": "Excludes EMS and intersegment sales; latest interim inputs rounded.", "comparisonGroup": "merchant-OSAT", "usdEquivalent": 13795158667.310999, "fxIsStalePresentationOnly": true, "aiOnly": false, "auditLocator": "reviews/ase.json, sourceChecks and calculations; packet keyMetrics for exact financial note.", "inputSourceBindings": [ { "input": "FY2025", "value": 380242.822, "sourceId": "ase:ase-20f-2025", "period": "FY2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; 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not advanced-packaging-only or AI-only.", "comparisonGroup": "merchant-OSAT", "usdEquivalent": 7457680000.0, "fxIsStalePresentationOnly": true, "aiOnly": false, "auditLocator": "reviews/amkor.json, sourceChecks and calculations; packet keyMetrics for exact financial note.", "inputSourceBindings": [ { "input": "FY2025", "value": 6707981, "sourceId": "amkor:amkr-10k-2025", "period": "FY2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2026", "value": 3582666, "sourceId": "amkor:amkr-q2-2026", "period": "H1_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2025", "value": 2832967, "sourceId": "amkor:amkr-q2-2026", "period": "H1_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "jcet", "metric": "Chip packaging and test revenue", "value": 39605837318.58, "currency": "CNY", "scale": 1, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "38714188000.05+19421039737.93-18529390419.40", "rawInputs": { "FY2025": 38714188000.05, "H1_2026": 19421039737.93, "H1_2025": 18529390419.4 }, "sourceIds": [ "jcet:jcet-ar25-full", "jcet:jcet-h126-full" ], "boundary": "Other activities excluded.", "comparisonGroup": "merchant-OSAT", "usdEquivalent": 5907086669.7954, "fxIsStalePresentationOnly": true, "aiOnly": false, "auditLocator": "reviews/jcet.json, sourceChecks and calculations; packet keyMetrics for exact financial note.", "inputSourceBindings": [ { "input": "FY2025", "value": 38714188000.05, "sourceId": "jcet:jcet-ar25-full", "period": "FY2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2026", "value": 19421039737.93, "sourceId": "jcet:jcet-h126-full", "period": "H1_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2025", "value": 18529390419.4, "sourceId": "jcet:jcet-h126-full", "period": "H1_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "tongfu", "metric": "Packaging and test revenue", "value": 30292635711.41, "currency": "CNY", "scale": 1, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "27247567100.76+15689400075.92-12644331465.27", "rawInputs": { "FY2025": 27247567100.76, "H1_2026": 15689400075.92, "H1_2025": 12644331465.27 }, "sourceIds": [ "tongfu:tongfu-ar2025", "tongfu:tongfu-h126-full" ], "boundary": "Consolidated packaging/test; AMD customer-specific sales not inferred from anonymous concentration.", "comparisonGroup": "merchant-OSAT", "usdEquivalent": 4518051800.407024, "fxIsStalePresentationOnly": true, "aiOnly": false, "auditLocator": "reviews/tongfu.json, sourceChecks and calculations; packet keyMetrics for exact financial note.", "inputSourceBindings": [ { "input": "FY2025", "value": 27247567100.76, "sourceId": "tongfu:tongfu-ar2025", "period": "FY2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2026", "value": 15689400075.92, "sourceId": "tongfu:tongfu-h126-full", "period": "H1_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2025", "value": 12644331465.27, "sourceId": "tongfu:tongfu-h126-full", "period": "H1_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "powertech", "metric": "Back-end revenue including module assembly", "value": 85804.999, "currency": "TWD", "scale": 1000000.0, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "19968+21407+44429.999", "rawInputs": { "Q3_2025_rounded": 19968, "Q4_2025_rounded": 21407, "H1_2026": 44429.999 }, "sourceIds": [ "powertech:pti-q425", "powertech:twse-income" ], "boundary": "Broader than pure OSAT; module assembly prevents exact like-for-like pooling.", "comparisonGroup": "memory-assembly-proxy", "usdEquivalent": 2698610121.0495, "fxIsStalePresentationOnly": true, "aiOnly": false, "auditLocator": "reviews/powertech.json, sourceChecks and calculations; packet keyMetrics for exact financial note.", "inputSourceBindings": [ { "input": "Q3_2025_rounded", "value": 19968, "sourceId": "powertech:pti-q425", "period": "Q3_2025_rounded", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Q4_2025_rounded", "value": 21407, "sourceId": "powertech:pti-q425", "period": "Q4_2025_rounded", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2026", "value": 44429.999, "sourceId": "powertech:twse-income", "period": "H1_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "ibiden", "metric": "Electronics external revenue", "value": 264553, "currency": "JPY", "scale": 1000000.0, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "243316+77522-56285", "rawInputs": { "FY_to_March_2026": 243316, "Q_to_June_2026": 77522, "Q_to_June_2025": 56285 }, "sourceIds": [ "ibiden:fy25", "ibiden:q126" ], "boundary": "Closest IC-substrate activity boundary; no AI-only split.", "comparisonGroup": "substrates", "usdEquivalent": 1676189553.8430002, "fxIsStalePresentationOnly": true, "aiOnly": false, "inputSourceBindings": [ { "input": "FY_to_March_2026", "value": 243316, "sourceId": "ibiden:fy25", "period": "FY_to_March_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Q_to_June_2026", "value": 77522, "sourceId": "ibiden:q126", "period": "Q_to_June_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Q_to_June_2025", "value": 56285, "sourceId": "ibiden:q126", "period": "Q_to_June_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "semco", "metric": "Package Solution revenue", "value": 2734.4, "currency": "KRW", "scale": 1000000000.0, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "593.2+644.6+725.0+771.6", "rawInputs": { "Q3_2025": 593.2, "Q4_2025": 644.6, "Q1_2026": 725.0, "Q2_2026": 771.6 }, "sourceIds": [ "semco:semco-4q25", "semco:semco-2q26" ], "boundary": "FC-BGA and BGA substrates; excludes passives and camera modules; rounded pre-audit quarter data.", "comparisonGroup": "substrates", "usdEquivalent": 2036781824.96, "fxIsStalePresentationOnly": true, "aiOnly": false, "inputSourceBindings": [ { "input": "Q3_2025", "value": 593.2, "sourceId": "semco:semco-4q25", "period": "Q3_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Q4_2025", "value": 644.6, "sourceId": "semco:semco-4q25", "period": "Q4_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Q1_2026", "value": 725.0, "sourceId": "semco:semco-2q26", "period": "Q1_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Q2_2026", "value": 771.6, "sourceId": "semco:semco-2q26", "period": "Q2_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "ats", "metric": "Microelectronics external revenue", "value": 910742, "currency": "EUR", "scale": 1000.0, "period": "Year ended March 31, 2026", "kind": "derived-from-reported-accounts", "formula": "1011693-100951", "rawInputs": { "segment_including_internal": 1011693, "internal_revenue": 100951 }, "sourceIds": [ "ats:ats-afr2526" ], "boundary": "IC substrates for PC/server; period three months earlier than TTM peers.", "comparisonGroup": "substrates-stale-period", "usdEquivalent": 1025263981.3836, "fxIsStalePresentationOnly": true, "aiOnly": false, "inputSourceBindings": [ { "input": "segment_including_internal", "value": 1011693, "sourceId": "ats:ats-afr2526", "period": "segment_including_internal", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "internal_revenue", "value": 100951, "sourceId": "ats:ats-afr2526", "period": "internal_revenue", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "asmpt", "metric": "Semiconductor Solutions revenue", "value": 8693178, "currency": "HKD", "scale": 1000.0, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "7380476+5035626-3722924", "rawInputs": { "FY2025": 7380476, "H1_2026": 5035626, "H1_2025": 3722924 }, "sourceIds": [ "asmpt:asmpt-annual2025", "asmpt:asmpt-interim2026" ], "boundary": "SEMI excludes SMT and disposed NEXX; still broader than advanced bonding. Advanced Packaging KPI overlaps segments and is not added.", "comparisonGroup": "assembly-equipment-proxy", "usdEquivalent": 1107933365.6508, "fxIsStalePresentationOnly": true, "aiOnly": false, "inputSourceBindings": [ { "input": "FY2025", "value": 7380476, "sourceId": "asmpt:asmpt-annual2025", "period": "FY2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2026", "value": 5035626, "sourceId": "asmpt:asmpt-interim2026", "period": "H1_2026", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "H1_2025", "value": 3722924, "sourceId": "asmpt:asmpt-interim2026", "period": "H1_2025", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "besi", "metric": "Die Attach plus Packaging revenue", "value": 717188, "currency": "EUR", "scale": 1000.0, "period": "TTM ended June 30, 2026", "kind": "derived-from-reported-accounts", "formula": "(474096+366577-235135)+(99098+59746-47194)", "rawInputs": { "DieAttach_FY25": 474096, "DieAttach_H126": 366577, "DieAttach_H125": 235135, "Packaging_FY25": 99098, "Packaging_H126": 59746, "Packaging_H125": 47194 }, "sourceIds": [ "besi:ar25", "besi:h126" ], "boundary": "Excludes plating; includes conventional and advanced assembly; not hybrid-bonding-only.", "comparisonGroup": "assembly-equipment-proxy", "usdEquivalent": 807371378.8104, "fxIsStalePresentationOnly": true, "aiOnly": false, "inputSourceBindings": [ { "input": "DieAttach_FY25", "value": 474096, "sourceId": "besi:ar25", "period": "DieAttach_FY25", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "DieAttach_H126", "value": 366577, "sourceId": "besi:h126", "period": "DieAttach_H126", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "DieAttach_H125", "value": 235135, "sourceId": "besi:h126", "period": "DieAttach_H125", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Packaging_FY25", "value": 99098, "sourceId": "besi:ar25", "period": "Packaging_FY25", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Packaging_H126", "value": 59746, "sourceId": "besi:h126", "period": "Packaging_H126", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" }, { "input": "Packaging_H125", "value": 47194, "sourceId": "besi:h126", "period": "Packaging_H125", "classification": "reported-accounting-input; rounding as disclosed", "locator": "Relevant product/segment revenue table; exact scope retained in observation and dossier metric locator" } ] }, { "companyId": "unimicron", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "PCB and IC carriers combined; full parent revenue would overstate substrates. Current comparable substrate-only revenue unknown.", "imputation": null, "rankFromMissingness": false }, { "companyId": "tsmc", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "Packaging/test/masks/other revenue not separated adequately; total foundry revenue and all wafer capacity invalid.", "imputation": null, "rankFromMissingness": false }, { "companyId": "samsung-electronics", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "Foundry packaging-only recognized revenue unavailable.", "imputation": null, "rankFromMissingness": false }, { "companyId": "intel", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "External Foundry assembly/test disclosure is mixed and does not isolate advanced packaging.", "imputation": null, "rankFromMissingness": false }, { "companyId": "shinko", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "Current private-company substrate-only accounts not established; no zero or financial penalty.", "imputation": null, "rankFromMissingness": false }, { "companyId": "kinsus", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "Current substrate-only comparable sales not reconstructed; TWSE deck supports actual production role.", "imputation": null, "rankFromMissingness": false }, { "companyId": "nanya-pcb", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "Product role established; comparable current activity unknown.", "imputation": null, "rankFromMissingness": false }, { "companyId": "hanmi", "metric": "Comparable current role revenue", "value": null, "kind": "unavailable", "boundary": "Reported order is not annual recognized revenue; direct issuer site blocked.", "imputation": null, "rankFromMissingness": false } ], "parameters": { "maximumRepresentatives": 10, "roleAllocationIsEditorial": true, "roleAllocation": { "foundry-integration": 1, "logic-assembly": 3, "memory-assembly": 1, "substrates": 3, "bonding-equipment": 2 }, "roleWeights": null, "globalCoverageThreshold": null, "normalization": "Only units and dated currency conversion for contextual within-function comparisons. No score normalization, z-score or 0–100 scale.", "missing": "Null; no funding, market-cap or parent-revenue replacement. Excluding a missing-data candidate is not asserted as a numerical victory.", "fx": { "provider": "Yahoo Finance (unofficial, via yahoo-finance2)", "retrievedAt": "2026-10-03T04:32:17.937Z", "rates": { "USD": 1, "AUD": 0.695749, "CAD": 0.70190215, "CHF": 1.2070297, "CNY": 0.14914687, "EUR": 1.1257458, "GBP": 1.3240473, "HKD": 0.1274486, "ILS": 0.32752523, "JPY": 0.006335931, "KRW": 0.0007448734, "KZT": 0.002231595, "SEK": 0.099577785, "TWD": 0.0314505 }, "meaning": "USD per currency unit; cached October 3 presentation conversion, not current or official FX.", "sensitivity": "Independent ±10% FX stress; changing role allocation is tested separately." } }, "methodsCompared": [ { "method": "Whole-company revenue", "decision": "rejected", "reason": "Would add ASE EMS, Samsung electronics, TSMC wafers, Unimicron PCBs and equipment vendors into incompatible totals." }, { "method": "Capacity or shipment count", "decision": "not globally usable", "reason": "Wafers, packages, substrate area and tools have different functions and specifications; announced capacity is not output." }, { "method": "Single weighted composite", "decision": "rejected", "reason": "Revenue, installed base and market share partly repeat scale; subjective technical scores would disguise choices and penalize disclosure." }, { "method": "Role-constrained representative set", "decision": "recommended with explicit cutoff uncertainty", "reason": "Uses relevant measured activity where comparable and preserves commercially important roles with incomplete financial disclosure. The choice of ten and slot allocation is editorial, not a scientific constant." } ], "selectedCompanyIds": [ "tsmc", "ase", "amkor", "jcet", "powertech", "unimicron", "semco", "ibiden", "asmpt", "besi" ], "selected": [ { "companyId": "tsmc", "displayOrder": 1, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Commercial foundry-integrated CoWoS/SoIC packaging is a distinct function; no whole-foundry revenue substituted." }, { "companyId": "ase", "displayOrder": 2, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Largest measured merchant packaging/test activity in the compared set; EMS and internal revenue excluded." }, { "companyId": "amkor", "displayOrder": 3, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Large commercial merchant packaging/test activity with independently documented current accounts." }, { "companyId": "jcet", "displayOrder": 4, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Large measured merchant packaging/test activity; other sales excluded." }, { "companyId": "powertech", "displayOrder": 5, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Commercial memory assembly/test and module integration; represents memory-specific back-end work, not a pure-OSAT revenue rank." }, { "companyId": "unimicron", "displayOrder": 6, "rankIsNumericallyOrdered": false, "status": "provisional-cutoff", "reason": "Commercial substrate production and broad current customer/technology exposure; chosen provisionally for a third substrate slot without fabricating substrate-only revenue." }, { "companyId": "semco", "displayOrder": 7, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Current FC-BGA/BGA production and separately measured Package Solution activity, excluding camera modules and passives." }, { "companyId": "ibiden", "displayOrder": 8, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Current IC-substrate activity with directly reconstructible Electronics revenue; future EMIB-T capacity excluded." }, { "companyId": "asmpt", "displayOrder": 9, "rankIsNumericallyOrdered": false, "status": "selected-representative", "reason": "Broad current semiconductor assembly and thermo-compression capability; more than 500 TCB tools company-stated in current product evidence, not an independent share." }, { "companyId": "besi", "displayOrder": 10, "rankIsNumericallyOrdered": false, "status": "provisional-cutoff", "reason": "Commercial hybrid-bonding integration and broader die-attach activity; differentiates direct hybrid bonding from HBM thermo-compression specialization." } ], "cutoff": { "uniqueTenthEstablished": false, "provisional": [ "unimicron", "besi" ], "alternatives": [ "tongfu", "shinko", "hanmi", "ats" ], "reason": "Tongfu enters if four merchant logic assemblers are preferred; Shinko can replace a substrate representative without penalizing private disclosure; Hanmi enters if HBM thermo-compression receives priority over hybrid-bonding breadth. No source-backed scalar proves a unique tenth company.", "stableAcrossDeclaredScenarios": [ "amkor", "ase", "asmpt", "ibiden", "jcet", "powertech", "semco", "tsmc" ], "scenarioBoundary": [ "ats", "besi", "hanmi", "shinko", "tongfu", "unimicron" ], "publicationRule": "Publish as ten representatives with visible provisional labels and alternatives, not as an exact global rank. A new coherent revenue/output denominator or stronger comparable evidence can resolve a function-specific comparison." }, "calculations": [ { "companyId": "ase", "formula": "380242.822+233074-174686", "result": 438630.822, "unit": "TWD", "scale": 1000000.0 }, { "companyId": "amkor", "formula": "6707981+3582666-2832967", "result": 7457680, "unit": "USD", "scale": 1000.0 }, { "companyId": "jcet", "formula": "38714188000.05+19421039737.93-18529390419.40", "result": 39605837318.58, "unit": "CNY", "scale": 1 }, { "companyId": "tongfu", "formula": "27247567100.76+15689400075.92-12644331465.27", "result": 30292635711.41, "unit": "CNY", "scale": 1 }, { "companyId": "powertech", "formula": "19968+21407+44429.999", "result": 85804.999, "unit": "TWD", "scale": 1000000.0 }, { "companyId": "ibiden", "formula": "243316+77522-56285", "result": 264553, "unit": "JPY", "scale": 1000000.0 }, { "companyId": "semco", "formula": "593.2+644.6+725.0+771.6", "result": 2734.4, "unit": "KRW", "scale": 1000000000.0 }, { "companyId": "ats", "formula": "1011693-100951", "result": 910742, "unit": "EUR", "scale": 1000.0 }, { "companyId": "asmpt", "formula": "7380476+5035626-3722924", "result": 8693178, "unit": "HKD", "scale": 1000.0 }, { "companyId": "besi", "formula": "(474096+366577-235135)+(99098+59746-47194)", "result": 717188, "unit": "EUR", "scale": 1000.0 } ], "sensitivityTests": [ { "test": "base", "selected": [ "tsmc", "ase", "amkor", "jcet", "powertech", "unimicron", "semco", "ibiden", "asmpt", "besi" ], "added": [], "removed": [], "interpretation": "Deliberate role-allocation or unresolved-comparison scenario, not an estimated probability." }, { "test": "four-logic-OSAT-two-substrates", "selected": [ "tsmc", "ase", "amkor", "jcet", "powertech", "semco", "ibiden", "asmpt", "besi", "tongfu" ], "added": [ "tongfu" ], "removed": [ "unimicron" ], "interpretation": "Deliberate role-allocation or unresolved-comparison scenario, not an estimated probability." }, { "test": "one-bonding-equipment-four-OSAT", "selected": [ "tsmc", "ase", "amkor", "jcet", "powertech", "unimicron", "semco", "ibiden", "asmpt", "tongfu" ], "added": [ "tongfu" ], "removed": [ "besi" ], "interpretation": "Deliberate role-allocation or unresolved-comparison scenario, not an estimated probability." }, { "test": "HBM-bonding-priority", "selected": [ "tsmc", "ase", "amkor", "jcet", "powertech", "unimicron", "semco", "ibiden", "asmpt", "hanmi" ], "added": [ "hanmi" ], "removed": [ "besi" ], "interpretation": "Deliberate role-allocation or unresolved-comparison scenario, not an estimated probability." }, { "test": "private-substrate-parity", "selected": [ "tsmc", "ase", "amkor", "jcet", "powertech", "semco", "ibiden", "asmpt", "besi", "shinko" ], "added": [ "shinko" ], "removed": [ "unimicron" ], "interpretation": "Deliberate role-allocation or unresolved-comparison scenario, not an estimated probability." }, { "test": "European-substrate-breadth", "selected": [ "tsmc", "ase", "amkor", "jcet", "powertech", "semco", "ibiden", "asmpt", "besi", "ats" ], "added": [ "ats" ], "removed": [ "unimicron" ], "interpretation": "Deliberate role-allocation or unresolved-comparison scenario, not an estimated probability." }, { "test": "independent-FX-stress", "pair": [ "ase", "amkor" ], "usd": [ 13795158667.310999, 7457680000.0 ], "multiplierRange": [ 0.9, 1.1 ], "orderStable": true, "interpretation": "Checks arithmetic order only within the specified activity proxies. Does not establish interchangeable products or global rank." }, { "test": "independent-FX-stress", "pair": [ "amkor", "jcet" ], "usd": [ 7457680000.0, 5907086669.7954 ], "multiplierRange": [ 0.9, 1.1 ], "orderStable": true, "interpretation": "Checks arithmetic order only within the specified activity proxies. Does not establish interchangeable products or global rank." }, { "test": "independent-FX-stress", "pair": [ "jcet", "tongfu" ], "usd": [ 5907086669.7954, 4518051800.407024 ], "multiplierRange": [ 0.9, 1.1 ], "orderStable": true, "interpretation": "Checks arithmetic order only within the specified activity proxies. Does not establish interchangeable products or global rank." }, { "test": "independent-FX-stress", "pair": [ "semco", "ibiden" ], "usd": [ 2036781824.96, 1676189553.8430002 ], "multiplierRange": [ 0.9, 1.1 ], "orderStable": false, "interpretation": "Checks arithmetic order only within the specified activity proxies. Does not establish interchangeable products or global rank." }, { "test": "independent-FX-stress", "pair": [ "asmpt", "besi" ], "usd": [ 1107933365.6508, 807371378.8104 ], "multiplierRange": [ 0.9, 1.1 ], "orderStable": true, "interpretation": "Checks arithmetic order only within the specified activity proxies. Does not establish interchangeable products or global rank." } ], "changesVersusPrior": { "prior": [ "ase", "amkor", "jcet", "tongfu", "unimicron", "disco", "powertech", "ats", "asmpt", "semco" ], "added": [ "besi", "ibiden", "tsmc" ], "removedFromTopSet": [ "ats", "disco", "tongfu" ], "disposition": "Removed names retain full dossiers. Tongfu is a leading cutoff alternative; AT&S is a substrate alternative; DISCO remains covered in manufacturing tools and its commercial wafer-preparation role is not denied." }, "limitations": [ "Ten slots cannot represent every material, test specialty and integration process. The function allocation is disclosed and sensitive.", "Revenue counts different transactions at different stages of the chain. It is never added into a single market share or claimed economic value.", "No robust global current packaging denominator was established. Selected-company subtotals are not used as market size.", "Financial statements are not independently verified customer-level shipment records. Broad segment revenue is not AI-only activity.", "Unknown substrate measures for Unimicron and Shinko prevent a strict substrate ranking; their inclusion/alternative status remains explicit.", "A single reported order for Hanmi establishes a commercial relationship, not current annual recognized sales or market leadership.", "Future SEMCO, Ibiden, Amkor and PTI capacity is excluded from present activity." ], "sources": [ { "id": "shinko-products", "url": "https://www.shinko.co.jp/english/product/package/", "title": "Semiconductor Package", "publisher": "Shinko", "publishedDate": null, "accessedDate": "2026-10-21", "locator": "Substrates and IC Assembly sections", "support": "Commercial FC package substrates, PBGA, coreless substrates and assembly; newer optical and 2.3D products not assigned volume from listing alone." }, { "id": "shinko-history", "url": "https://www.shinko.co.jp/english/corporate/history/", "title": "Our History", "publisher": "Shinko", "publishedDate": null, "accessedDate": "2026-10-21", "locator": "2025 entries", "support": "Tender completed, delisting and absorption into renamed JICC-04; no longer treated as listed Fujitsu subsidiary." }, { "id": "shinko-profile", "url": "https://www.shinko.co.jp/english/corporate/profile/", "title": "Corporate Outline", "publisher": "Shinko", "publishedDate": null, "accessedDate": "2026-10-21", "locator": "Corporate profile", "support": "Current operating business and 5,256 consolidated employees as of March 31, 2026. Headcount is not a ranking input." }, { "id": "kinsus-deck", "url": "https://www.twse.com.tw/staticFiles/news/event/8a8216d69d2e8217019d6674e5ba00c5.pdf", "title": "IC Packaging Technology and Kinsus Overview", "publisher": "Kinsus / TWSE", "publishedDate": "2026-02", "accessedDate": "2026-10-21", "locator": "pp. 7–11 and 16–18", "support": "Current commercial IC substrate role and Taiwan manufacturing sites. Image-only product mix not numerically extracted or used." }, { "id": "nanya-pcb-roadmap", "url": "https://www.nanyapcb.com.tw/nypcb/chinese/Technology/ABFSRoadmap", "title": "ABF Substrate Technology Roadmap", "publisher": "Nan Ya PCB", "publishedDate": null, "accessedDate": "2026-10-21", "locator": "Current capability and separate 2026/2027 columns", "support": "Current ABF substrate capability distinct from prospective feature sizes and layer counts." }, { "id": "hanmi-contract-report", "url": "https://en.yna.co.kr/view/AEN20260114005000320", "title": "SK hynix orders new equipment, possibly for production of next-gen HBM4", "publisher": "Yonhap", "publishedDate": "2026-01-14", "accessedDate": "2026-10-21", "locator": "Article body: regulatory filing report", "support": "Reported KRW9.7bn Hanmi TC-bonder order, delivery planned by April. Model and three-unit interpretation are speculation and are not adopted.", "type": "secondary; issuer host blocked" } ], "packetSourceRegister": { "tsmc": [ { "id": "tsmc-20f-2025", "url": "https://www.sec.gov/Archives/edgar/data/1046179/000162828026025362/tsm-20251231.htm", "title": "TSMC Annual Report on Form 20-F for fiscal year 2025", "publisher": "Taiwan Semiconductor Manufacturing Company Limited (SEC EDGAR)", "publishedDate": "2026-04-16", "type": "filing", "accessedDate": "2026-10-02" }, { "id": "yahoo-tsm", "url": "https://finance.yahoo.com/quote/TSM/", "title": "TSM quote, profile, officers and holders", "publisher": "Yahoo Finance", "publishedDate": null, "type": "data_provider", "accessedDate": "2026-10-02" }, { "id": "tsmc-exec-page", "url": "https://www.tsmc.com/english/aboutTSMC/executives", "title": "TSMC Executives", "publisher": "TSMC", "publishedDate": null, "type": "company", "accessedDate": "2026-10-20" }, { "id": "trendforce-cowos-dec25", "url": "https://www.trendforce.com/news/2025/12/08/news-tsmcs-cowos-l-s-reportedly-fully-booked-osat-partners-step-up-with-ases-cowop-in-focus/", "title": "TSMC's CoWoS-L/S Reportedly Fully Booked, OSAT Partners Step up with ASE's CoWoP in Focus", "publisher": "TrendForce", "publishedDate": "2025-12-08", "type": "media", "accessedDate": "2026-10-20" }, { "id": "intel-10k-2025", "url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "title": "Intel Corporation Form 10-K for fiscal year 2025", "publisher": "Intel Corporation (SEC EDGAR)", "publishedDate": "2026-01-23", "type": "filing", "accessedDate": "2026-10-02" }, { "id": "amd-10k-2025", "url": "https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm", "title": "AMD Form 10-K for fiscal year 2025", "publisher": "Advanced Micro Devices, Inc. (SEC EDGAR)", "publishedDate": "2026-02-04", "type": "filing", "accessedDate": "2026-10-02" }, { "id": "nvda-10k-fy2026", "url": "https://www.sec.gov/Archives/edgar/data/1045810/000104581026000021/nvda-20260125.htm", "title": "NVIDIA Form 10-K for fiscal year 2026", "publisher": "NVIDIA Corporation (SEC EDGAR)", "publishedDate": "2026-02-25", "type": "filing", "accessedDate": "2026-10-02" }, { "id": "avgo-10k-fy2025", "url": "https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm", "title": "Broadcom Form 10-K for fiscal year 2025", "publisher": "Broadcom Inc. (SEC EDGAR)", "publishedDate": "2025-12-18", "type": "filing", "accessedDate": "2026-10-02" }, { "id": "qcom-10k-fy2025", "url": "https://www.sec.gov/Archives/edgar/data/804328/000080432825000085/qcom-20250928.htm", "title": "Qualcomm Form 10-K for fiscal year 2025", "publisher": "Qualcomm Incorporated (SEC EDGAR)", "publishedDate": "2025-11-05", "type": "filing", "accessedDate": "2026-10-02" }, { "id": "cerebras-424b4", "url": "https://www.sec.gov/Archives/edgar/data/2021728/000162828026035214/cerebras-424b4.htm", "title": "Cerebras Systems final prospectus (Form 424B4)", "publisher": "Cerebras Systems Inc. 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= −40.540" }, { "label": "Cash and cash equivalents", "value": "91.292", "unit": "TWD billion", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ase-q226-wire" ], "locator": "Balance sheet" }, { "label": "Research and development expense", "value": "19.439", "unit": "TWD billion", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ase-q226-wire" ], "locator": "Operating expense table" }, { "label": "September revenue", "value": "88.130084", "unit": "TWD billion", "period": "September 2026", "asOf": "2026-09-30", "evidence": "filing", "sourceIds": [ "twse-revenue" ], "locator": "3711; not a full quarterly financial statement" }, { "label": "Nine-month revenue", "value": "608.886833", "unit": "TWD billion", "period": "January–September 2026", "asOf": "2026-09-30", "evidence": "filing", "sourceIds": [ "twse-revenue" ], "locator": "3711 cumulative monthly revenue; 2025 comparator 467.472473" }, { "label": "Equipment installed", "value": "24,815 wire bonders; 8,348 testers", "unit": "machines", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ase-q226-wire" ], "locator": "Equipment table; unlike devices and configurations are not interchangeable" }, { "label": "Computing revenue mix", "value": "30", "unit": "percent of ATM revenue", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ase-q226-wire" ], "locator": "ATM end-market mix; computing is broader than AI" }, { "label": "Five largest customers", "value": "46.5", "unit": "percent of group revenue", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "ase-20f-2025" ], "locator": "Customer concentration" }, { "label": "Internal substrate sourcing", "value": "8.7", "unit": "percent by value", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "ase-20f-2025" ], "locator": "Materials sourcing discussion" } ], "calculations": [ { "formula": "380242.822+233074-174686", "result": 438630.822, "unit": "TWD million", "meaning": "TTM external packaging+testing; interim rounded, no EMS or intersegment sales" }, { "formula": "83401-123941", "result": -40540, "unit": "TWD million", "meaning": "H1 operating cash flow less net PPE payments" }, { "formula": "161282046/645387710*100", "result": 24.989946895642, "unit": "percent", "meaning": "FY25 unnamed customer including on-behalf transactions" } ] }, "amkor": { "path": "chips/packets/amkor.json", "sha256": "c970288657f1f7b65d10c77c9c1e654fab93d524573ee4161545034cd3b63db9", "reviewPath": "chips/reviews/amkor.json", "reviewSha256": "45c372069ac765c13a8bd6eb2c7f316792c9ca5a2f58c2928b1fe2bc2dcddab6", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Net sales", "value": "US$6,708.0 million, up 6.2%; gross margin 14.0%; net income US$373.9 million", "unit": "USD", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "amkr-10k-2025" ], "locator": "Form 10-K FY2025, Item 7 2025 Financial Summary; consolidated statements" }, { "label": "Quarterly net sales", "value": "US$1.90 billion, a record, up 26% year over year; gross margin 16.8%; net income US$174 million", "unit": "USD", "period": "2Q26 (quarter)", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "2Q26 results release, Jul 27, 2026" }, { "label": "Guidance", "value": "3Q26 net sales US$1.95-2.05 billion, gross margin 18.5-19.5%; full-year 2026 capital expenditure US$2.5-3.0 billion (vs US$904.6 million in 2025)", "unit": "USD", "period": "3Q26 / FY2026 (guidance)", "asOf": "2026-07-27", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026", "amkr-10k-2025" ], "locator": "2Q26 results release (outlook); Form 10-K FY2025, Item 7" }, { "label": "Arizona campus planned investment", "value": "About US$12 billion across two phases (phase 1 about 33,000 m2 of cleanroom, phase 2 a further 60,000 m2); more than 3,500 planned jobs", "unit": "USD", "period": "Plan announced Sep 2026", "asOf": "2026-09-08", "evidence": "company_stated", "sourceIds": [ "amkr-az-phase2" ], "locator": "Press release, Sep 8, 2026" }, { "label": "Employees", "value": "30,800 (about 95% in Asia-Pacific, 4% in Europe, 1% in the US)", "unit": "people", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "amkr-10k-2025" ], "locator": "Form 10-K FY2025, Item 1 Human Capital Resources" }, { "label": "Operating income, FY2025", "value": "467385", "unit": "USD thousand", "period": "Year ended December 31, 2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "amkr-10k-2025" ], "locator": "Consolidated statements" }, { "label": "Operating cash flow, FY2025", "value": "1095606", "unit": "USD thousand", "period": "Year ended December 31, 2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "amkr-10k-2025" ], "locator": "Consolidated statements" }, { "label": "Property and equipment purchases, FY2025", "value": "904614", "unit": "USD thousand", "period": "Year ended December 31, 2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "amkr-10k-2025" ], "locator": "Consolidated statements" }, { "label": "Revenue, H1 2026", "value": "3582666", "unit": "USD thousand", "period": "Six months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "Unaudited financial tables" }, { "label": "Revenue, Q2 2026", "value": "1897965", "unit": "USD thousand", "period": "Three months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "Unaudited financial tables" }, { "label": "Operating income, Q2 2026", "value": "199854", "unit": "USD thousand", "period": "Three months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "Unaudited financial tables" }, { "label": "Operating cash flow, H1 2026", "value": "381573", "unit": "USD thousand", "period": "Six months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "Unaudited financial tables" }, { "label": "Property and equipment purchases, H1 2026", "value": "688425", "unit": "USD thousand", "period": "Six months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "Unaudited financial tables" }, { "label": "Revenue, trailing twelve months", "value": "7457680", "unit": "USD thousand", "period": "TTM ended June 30, 2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "amkr-10k-2025", "amkr-q2-2026" ], "locator": "6707981+3582666−2832967" }, { "label": "Q2 Advanced Products and Mainstream Products", "value": "1557 advanced; 341 mainstream", "unit": "USD million", "period": "Quarter ended June 30, 2026; rounded categories", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "amkr-q2-2026" ], "locator": "Selected operating data; neither category is AI-only" } ], "calculations": [ { "formula": "6707981+3582666−2832967", "result": 7457680, "unit": "USD thousand", "meaning": "TTM total packaging/test revenue" }, { "formula": "381573−688425", "result": -306852, "unit": "USD thousand", "meaning": "H1 operating cash flow less property/equipment purchases" } ] }, "jcet": { "path": "chips/packets/jcet.json", "sha256": "de06e87fe2f792bfb0c779095b30f0cc334f35150f1b49a37b588f3f76653048", "reviewPath": "chips/reviews/jcet.json", "reviewSha256": "7937ec776d410f4f7be3c508aac022b058d6a05e424d7b2be9b45e643087867e", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "FY2025 group revenue", "value": "38.87134833123", "unit": "CNY billion", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "jcet-ar25-full" ], "locator": "Annual p. 6" }, { "label": "FY2025 chip packaging and test revenue", "value": "38.71418800005", "unit": "CNY billion", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "jcet-ar25-full" ], "locator": "Annual p. 16;other activities excluded" }, { "label": "FY2025 attributable net profit", "value": "1.56523803645", "unit": "CNY billion", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "jcet-ar25-full" ], "locator": "Annual p. 6" }, { "label": "H1 2026 group revenue and attributable profit", "value": "19.52722332313 revenue; 0.84464427504 attributable profit", "unit": "CNY billion", "period": "H1 2026, unaudited", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "jcet-h126-full" ], "locator": "Interim p. 6" }, { "label": "H1 chip packaging and test revenue", "value": "19.42103973793", "unit": "CNY billion", "period": "H1 2026; H1 2025 comparator 18.52939041940", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "jcet-h126-full" ], "locator": "Interim note 61 pp. 124–125" }, { "label": "Trailing chip packaging and test revenue", "value": "39.60583731858", "unit": "CNY billion", "period": "TTM to June 30, 2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "jcet-ar25-full", "jcet-h126-full" ], "locator": "38.71418800005+19.42103973793−18.52939041940" }, { "label": "H1 operating cash flow and capital investment", "value": "2.96442685322 operating cash flow; 4.70014524884 long-term asset payments", "unit": "CNY billion", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "jcet-h126-full" ], "locator": "Interim pp. 13–14" }, { "label": "H1 R&D expense", "value": "1.03433692355", "unit": "CNY billion", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "jcet-h126-full" ], "locator": "Interim p. 13" }, { "label": "2026 technology bond", "value": "2.4 principal; 1.85% initial coupon", "unit": "CNY billion;percent", "period": "Issued May 29; value June 1, 2026; ten-year term", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "jcet-h126-full" ], "locator": "Bond section and note; year-five reset/put provisions" }, { "label": "Employees", "value": "24,952", "unit": "people", "period": "December 31, 2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "jcet-ar25-full" ], "locator": "Annual p. 42" }, { "label": "Manufacturing locations", "value": "8", "unit": "facilities", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "jcet-h126-prn" ], "locator": "China, Korea, Singapore; not weighted capacity" }, { "label": "Planned Shanghai advanced-packaging investment", "value": "7.8", "unit": "CNY billion", "period": "Announced June 2026;future project", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "jcet-h126-full" ], "locator": "Interim p. 16; subsidiary established by report publication" } ], "calculations": [ { "formula": "38714188000.05+19421039737.93-18529390419.40", "result": 39605837318.58, "unit": "CNY", "meaning": "TTM chip packaging and test revenue; other activities excluded" }, { "formula": "2964426853.22-4700145248.84", "result": -1735718395.62, "unit": "CNY", "meaning": "H1 operating cash flow less long-term asset payments" } ] }, "tongfu": { "path": "chips/packets/tongfu.json", "sha256": "30bbb664a8e27ee23b894b5f1a8345f582d5ed4bfada33e30676324f657fec11", "reviewPath": "chips/reviews/tongfu.json", "reviewSha256": "e831ab4c3054d40191aa9818261849de5ff21bde0a0a746ab1b3641297fb9dda", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Revenue from largest customer", "value": "52.29% (RMB 14.60 billion); top five 69.54%", "unit": "% of revenue", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "tongfu-ar2025" ], "locator": "2025 Annual Report, Section 3 (top five customers)" }, { "label": "AMD purchases from the Tongfu ATMP joint ventures", "value": "US$2.0 billion (US$1.7 billion in 2024)", "unit": "USD", "period": "AMD FY2025", "asOf": "2025-12-27", "evidence": "filing", "sourceIds": [ "amd-10k-fy2025" ], "locator": "AMD Form 10-K FY2025, Note 7" }, { "label": "Employees", "value": "25,446", "unit": "people", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "tongfu-ar2025" ], "locator": "2025 Annual Report, Section 4 (employees)" }, { "label": "Annual total and packaging/test revenue", "value": "27,921.424656 total; 27,247.567101 packaging/test", "unit": "CNY million", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "tongfu-ar2025" ], "locator": "Annual p.18" }, { "label": "First-half total and packaging/test revenue", "value": "16,041.019910 total; 15,689.400076 packaging/test", "unit": "CNY million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "tongfu-h126-full" ], "locator": "Interim pp.17–18" }, { "label": "Trailing packaging/test revenue", "value": "30,292.635711", "unit": "CNY million", "period": "TTM to June 30, 2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "tongfu-ar2025", "tongfu-h126-full" ], "locator": "27,247.567101 + 15,689.400076 − 12,644.331465" }, { "label": "H1 attributable profit and profit excluding nonrecurring items", "value": "1,717.458597 attributable; 747.461287 excluding nonrecurring items", "unit": "CNY million", "period": "H1 2026, unaudited", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "tongfu-h126-full" ], "locator": "Interim p.7" }, { "label": "Fair-value gains", "value": "1,144.915189", "unit": "CNY million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "tongfu-h126-full" ], "locator": "Interim note50; trading and non-current financial assets" }, { "label": "H1 operating cash flow and long-term asset investment", "value": "2,932.766962 operating cash flow; 5,198.726579 asset purchases", "unit": "CNY million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "tongfu-h126-full" ], "locator": "Interim pp.7,17; residual −2,265.959617" }, { "label": "Placement proceeds received", "value": "4,219.999972 gross; 4,208.975840 net", "unit": "CNY million", "period": "Funds transferred August 26, 2026; listing scheduled September 16", "asOf": "2026-08-26", "evidence": "filing", "sourceIds": [ "tongfu-placement" ], "locator": "Printed pp.14–15; auditor capital-verification reports" }, { "label": "New shares issued", "value": "76,200,794 at RMB 55.38", "unit": "shares and CNY per share", "period": "2026 placement", "asOf": "2026-09-12", "evidence": "filing", "sourceIds": [ "tongfu-placement" ], "locator": "Printed p.4; post-issue share count 1,593,797,706" } ], "calculations": [ { "formula": "27247567100.76+15689400075.92-12644331465.27", "result": 30292635711.41, "unit": "CNY", "meaning": "TTM packaging and test revenue" }, { "formula": "2932766961.74-5198726578.75", "result": -2265959617.01, "unit": "CNY", "meaning": "H1 operating cash flow less long-term asset purchases" }, { "formula": "1717458597.00-747461286.61", "result": 969997310.39, "unit": "CNY", "meaning": "Attributable nonrecurring profit reconciliation" } ] }, "powertech": { "path": "chips/packets/powertech.json", "sha256": "61c53390c80c89dc45bec165fb70a87914c9833384dda0ad0b2d1dbc4e9d8b9e", "reviewPath": "chips/reviews/powertech.json", "reviewSha256": "fcb2dc3adfc4592cf7672adf559242609051264ece20f61cd9d151645e592573", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Annual revenue and operating profit", "value": "74,929 revenue; 8,132 operating profit; 5,536 attributable net income", "unit": "TWD million", "period": "FY2025", "asOf": "2025-12-31", "evidence": "company_stated", "sourceIds": [ "pti-q425" ], "locator": "Public presentation slides 4–10; rounded" }, { "label": "H1 consolidated results", "value": "44,429.999 revenue; 6,291.291 operating profit; 4,063.013 attributable net income", "unit": "TWD million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "twse-income" ], "locator": "Company 6239; original TWD thousand" }, { "label": "Trailing consolidated activity", "value": "Approximately 85,805", "unit": "TWD million", "period": "TTM to June 30, 2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "pti-q425", "twse-income" ], "locator": "19,968 + 21,407 + 44,429.999; includes module assembly; rounded historical quarters" }, { "label": "Monthly and cumulative revenue", "value": "8,506.551 September; 69,764.228 January–September", "unit": "TWD million", "period": "September / nine months 2026", "asOf": "2026-09-30", "evidence": "filing", "sourceIds": [ "twse-monthly-rev" ], "locator": "Company 6239; year-to-date growth 30.346%" }, { "label": "Year-end balance sheet", "value": "16,344 cash; 123,151 assets; 51,876 liabilities", "unit": "TWD million", "period": "December 31, 2025", "asOf": "2025-12-31", "evidence": "company_stated", "sourceIds": [ "pti-q425" ], "locator": "Public presentation balance sheet; rounded" }, { "label": "Panel program capacity timetable", "value": "1,000 installed panels/month in 2026; 5,000 planned in 2028", "unit": "510×510 mm panels per month", "period": "August 2026 management description", "asOf": "2026-08-26", "evidence": "reported", "sourceIds": [ "pti-foplp" ], "locator": "Installed capacity and future expansion; not utilized output" } ], "calculations": [ { "formula": "19968+21407+44429.999", "result": 85804.999, "unit": "TWD million", "meaning": "TTM whole back-end company activity, including module assembly; rounded historical inputs" } ] }, "unimicron": { "path": "chips/packets/unimicron.json", "sha256": "087e93aa87b5c9c888de02500f0b3a6477be067558156e15581a8839ff17d9e4", "reviewPath": "chips/reviews/unimicron.json", "reviewSha256": "8f1a29d7cc21bcbcaf137864286c705cd2dd140cd52e64a7e2f11817fb5df20f", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Employees", "value": "31,448", "unit": "people", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "unimicron-ar2025" ], "locator": "2025 Annual Report, 4.3" }, { "label": "H1 consolidated results", "value": "80,336.273 revenue; 9,407.786 operating profit; 18,157.914 attributable net income", "unit": "TWD million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "twse-income" ], "locator": "Company 3037; original TWD thousand" }, { "label": "Non-operating income and pre-tax profit", "value": "12,466.846 non-operating income; 21,874.632 pre-tax profit", "unit": "TWD million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "twse-income" ], "locator": "Non-operating income is approximately 57.0% of pre-tax profit; underlying note unavailable" }, { "label": "Monthly and cumulative revenue", "value": "18,650.679 September; 132,986.108 January–September", "unit": "TWD million", "period": "September / nine months 2026", "asOf": "2026-09-30", "evidence": "filing", "sourceIds": [ "twse-monthly-rev" ], "locator": "Monthly growth 64.666% year over year; cumulative growth 37.738%" }, { "label": "Issued common shares", "value": "1,641,291,596", "unit": "shares", "period": "October 20, 2026", "asOf": "2026-10-20", "evidence": "filing", "sourceIds": [ "twse-basic" ], "locator": "Current company profile" }, { "label": "Equipment procurement", "value": "1,757.345050", "unit": "TWD million", "period": "September 18, 2025–September 17, 2026", "asOf": "2026-09-17", "evidence": "filing", "sourceIds": [ "uni-equipment" ], "locator": "Cumulative disclosed batch from NIKKO-MATERIALS; not total group capex" } ], "calculations": [ { "formula": "12466846/21874632*100", "result": 56.992254772560294, "unit": "percent", "meaning": "Non-operating income as proportion of H1 pre-tax income" }, { "formula": "204423723/1641291596*100", "result": 12.455052075950555, "unit": "percent", "meaning": "Illustrative UMC ratio using September shares and October issued shares; not exact same-date register" } ] }, "semco": { "path": "chips/packets/semco.json", "sha256": "f6a2d97cd579087a9e9ef5e403bd8d54bc8373e39eaa2d8bbfe7ac02d1841149", "reviewPath": "chips/reviews/semco.json", "reviewSha256": "b5663a48112c6e90ccd6fc8c31e6546c94612b0bb590551042982bd476efdd98", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "FY2025 group sales and operating profit", "value": "11,314.459 sales; 913.331 operating profit", "unit": "KRW billion", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "semco-audit2025" ], "locator": "Note 3 audited segments" }, { "label": "FY2025 Package Solution revenue and operating profit", "value": "2,301.753 sales; 135.226 operating profit", "unit": "KRW billion", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "semco-audit2025" ], "locator": "Note 3; operating margin 5.8749% calculated" }, { "label": "H1 Package Solution revenue", "value": "1,496.6", "unit": "KRW billion", "period": "H1 2026, pre-audit presentation", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "semco-2q26" ], "locator": "Q1 725.0 + Q2 771.6" }, { "label": "Trailing Package Solution revenue", "value": "2,734.4", "unit": "KRW billion", "period": "TTM to June 30, 2026; rounded quarterly presentations", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "semco-4q25", "semco-2q26" ], "locator": "593.2+644.6+725.0+771.6; not AI-only" }, { "label": "H1 group sales and operating profit", "value": "6,666.3 sales; 721.0 operating profit", "unit": "KRW billion", "period": "H1 2026, pre-audit presentation", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "semco-2q26" ], "locator": "Q1+Q2" }, { "label": "H1 attributable net income", "value": "564.9", "unit": "KRW billion", "period": "H1 2026, pre-audit presentation", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "semco-2q26" ], "locator": "249.2+315.7; distinct from group profit 581.0" }, { "label": "Cash and debt", "value": "3,314.4 cash; 2,994.4 debt", "unit": "KRW billion", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "semco-2q26" ], "locator": "Financial position table" }, { "label": "H1 operating cash flow and investment", "value": "1,035.7 operating cash flow; 868.9 tangible/intangible investment", "unit": "KRW billion", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "semco-2q26" ], "locator": "Quarterly cash-flow table sums; residual 166.8" }, { "label": "Customer advances under long-term supply contracts", "value": "520", "unit": "USD million", "period": "December 31, 2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "semco-audit2025" ], "locator": "Long-term supply contracts note" }, { "label": "Planned FC-BGA investment", "value": "4.27 Sejong + 2.51 Vietnam = 6.78", "unit": "KRW trillion", "period": "Announced September 29, 2026; future spend", "asOf": "2026-09-29", "evidence": "company_stated", "sourceIds": [ "semco-invest" ], "locator": "Sejong mass production September 2028; Vietnam operations June 2030" } ], "calculations": [ { "formula": "593.2+644.6+725.0+771.6", "result": 2734.4, "unit": "KRW billion", "meaning": "TTM Package Solution revenue; rounded quarterly amounts" }, { "formula": "135226/2301753*100", "result": 5.874913598461695, "unit": "percent", "meaning": "FY25 audited Package Solution operating margin" }, { "formula": "556.8+478.9-603.9-265.0", "result": 166.8, "unit": "KRW billion", "meaning": "H1 operating cash flow less tangible/intangible investment" } ] }, "ibiden": { "path": "chips/packets/ibiden.json", "sha256": "76a9c10cf63f514f700e2aae156bcda6c425673076d54d331acdcad3dd82f741", "reviewPath": "chips/reviews/ibiden.json", "reviewSha256": "013c70e0f5fa9c81cb60389d8d1e27eefa6ed66c772eb84ecb262c24c3aae55f", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Revenue and profit, 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2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "fy25", "q126" ], "locator": "243316 + 77522 − 56285, JPY million" }, { "label": "Trailing consolidated revenue", "value": "441.956", "unit": "JPY billion", "period": "Twelve months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "fy25", "q126" ], "locator": "416201 + 123219 − 97464, JPY million" }, { "label": "Cash and deposits", "value": "370.505", "unit": "JPY billion", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "q126" ], "locator": "Balance sheet" }, { "label": "Operating cash flow and increase in advances", "value": "95.892 operating cash flow; 73.575 increase in advances received", "unit": "JPY billion", "period": "Q1 FY2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "q126" ], "locator": "Cash-flow statement" }, { "label": "FY2025 gains on investment-security sales", "value": "49.448", "unit": "JPY billion", 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"locator": "Annual pp.4–6,28" }, { "label": "Operating cash flow, FY2025/26", "value": "413718", "unit": "EUR thousand", "period": "Year ended March 31, 2026", "asOf": "2026-03-31", "evidence": "filing", "sourceIds": [ "ats-afr2526" ], "locator": "Annual pp.4–6,28" }, { "label": "Capital expenditures on PPE and intangible assets", "value": "179419", "unit": "EUR thousand", "period": "Year ended March 31, 2026", "asOf": "2026-03-31", "evidence": "filing", "sourceIds": [ "ats-afr2526" ], "locator": "Annual pp.4–6,28" }, { "label": "Cash and cash equivalents, March 2026", "value": "738492", "unit": "EUR thousand", "period": "As of March 31, 2026", "asOf": "2026-03-31", "evidence": "filing", "sourceIds": [ "ats-afr2526" ], "locator": "Annual pp.4–6,28" }, { "label": "Financial liabilities, March 2026", "value": "2145830", "unit": "EUR thousand", "period": "As of March 31, 2026", "asOf": "2026-03-31", "evidence": "filing", "sourceIds": [ "ats-afr2526" ], "locator": "Annual pp.4–6,28" }, { "label": "Revenue, Q1 FY2026/27", "value": "548.7", "unit": "EUR million", "period": "Three months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Key figures table" }, { "label": "EBITDA, Q1 FY2026/27", "value": "165.0", "unit": "EUR million", "period": "Three months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Key figures table" }, { "label": "Operating profit, Q1 FY2026/27", "value": "73.4", "unit": "EUR million", "period": "Three months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Key figures table" }, { "label": "Net profit, Q1 FY2026/27", "value": "40.8", "unit": "EUR million", "period": "Three months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Key figures table" }, { "label": "Operating cash flow, 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"company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Liquidity paragraph" }, { "label": "Hybrid convertible financing", "value": "400 principal; 2.5% coupon; €254 initial conversion price", "unit": "EUR million unless noted", "period": "Issued June 16, 2026", "asOf": "2026-06-16", "evidence": "company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Financing paragraph" }, { "label": "Employee headcount", "value": "14939", "unit": "people including contract staff", "period": "June 30, 2026; average quarter headcount 14569", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "ats-q1-ots" ], "locator": "Table footnote" }, { "label": "Five largest customers", "value": "76.5", "unit": "% of group revenue", "period": "FY2025/26; individual shares between 3% and 31%", "asOf": "2026-03-31", "evidence": "filing", "sourceIds": [ "ats-afr2526" ], "locator": "Annual p.29" } ], "calculations": [ { "metric": "TTM group revenue", "formula": "1790.776+548.7−398.9", 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"period": "Six months ended June 30, 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "asmpt-interim2026" ], "locator": "Printed pp.4,22–23,26" }, { "label": "Cash and cash equivalents", "value": "5143548", "unit": "HKD thousand", "period": "As of June 30, 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "asmpt-interim2026" ], "locator": "Printed pp.4,22–23,26" }, { "label": "Bank deposits over three months", "value": "732316", "unit": "HKD thousand", "period": "As of June 30, 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "asmpt-interim2026" ], "locator": "Printed pp.4,22–23,26" }, { "label": "Bank borrowings", "value": "2250000", "unit": "HKD thousand", "period": "As of June 30, 2026", "asOf": "2026-06-30", "evidence": "filing", "sourceIds": [ "asmpt-interim2026" ], "locator": "Printed pp.4,22–23,26" }, { "label": "Continuing revenue, trailing twelve months", "value": "16389544", "unit": "HKD thousand", "period": "TTM ended June 30, 2026; NEXX excluded", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "asmpt-annual2025", "asmpt-interim2026" ], "locator": "13736243+8902600−6249299" }, { "label": "Semiconductor Solutions revenue, trailing twelve months", "value": "8693178", "unit": "HKD thousand", "period": "TTM ended June 30, 2026; broad packaging equipment/services", "asOf": "2026-06-30", "evidence": "inference", "sourceIds": [ "asmpt-annual2025", "asmpt-interim2026" ], "locator": "7380476+5035626−3722924" }, { "label": "Advanced-packaging category revenue", "value": "532.1 FY2025; 339.0 H1 2026", "unit": "USD million", "period": "Management category; overlaps SEMI and SMT", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "asmpt-fy2025", "asmpt-1h2026" ], "locator": "Advanced Packaging sections" }, { "label": "Continuing bookings, H1 2026", "value": "12753.8", "unit": "HKD million", "period": "Six months ended June 30, 2026; not revenue", "asOf": "2026-06-30", "evidence": 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