{ "schema": "5lc-selection-review/1", "sublayer": "foundry", "asOf": "2026-10-21", "status": "source-and-consistency-reviewed; final-editorial-review-pending", "scope": "Current wafer-manufacturing enterprises supplying AI compute and supporting semiconductors. Merchant foundries and integrated advanced-logic production roles are distinguished.", "commercialEligibility": "Current wafer production or commercial foundry service is required. Pilot lines, funding, prospective customer commitments and capacity under construction are tracked separately. Public/private ownership does not determine eligibility.", "predefinedFunctions": [ { "id": "advanced-logic", "definition": "Current manufacture of advanced processors used for AI training, inference or server computing; internal manufacturing qualifies as a production role but not merchant revenue.", "minimumRepresentatives": 2 }, { "id": "specialty-control-power", "definition": "Current analog, power, mixed-signal, embedded-memory and connectivity processes used around AI processors and servers.", "minimumRepresentatives": 2 }, { "id": "optical-interconnect", "definition": "Current high-speed optical transceiver IC or photonics manufacturing, with production evidence distinct from future pilot announcements.", "minimumRepresentatives": 1 }, { "id": "memory-wafer-service", "definition": "Merchant memory wafer manufacturing and mature logic supporting memory systems, distinct from branded memory-chip sales.", "minimumRepresentatives": 1 } ], "universe": [ { "id": "tsmc", "functions": [ "advanced-logic", "specialty-control-power", "optical-interconnect" ], "disposition": "selected", "reason": "Largest merchant foundry, current HPC production and broad process portfolio; Q3 issuer results confirm continuing activity.", "evidence": [ "../packets/tsmc.json", "../reviews/tsmc.json" ] }, { "id": "samsung-electronics", "functions": [ "advanced-logic", "specialty-control-power" ], "disposition": "selected", "reason": "Foundry operating business retained through the canonical Samsung entity; advanced production and HBM base-die role. Parent revenue is not used.", "evidence": [ "../packets/samsung-electronics.json", "../reviews/samsung-electronics.json" ] }, { "id": "smic", "functions": [ "advanced-logic", "specialty-control-power", "memory-wafer-service" ], "disposition": "selected", "reason": "Large current manufacturing activity, Chinese advanced and mature processes; restricted access and node interpretation remain in dossier.", "evidence": [ "../packets/smic.json", "../reviews/smic.json" ] }, { "id": "umc", "functions": [ "specialty-control-power", "memory-wafer-service" ], "disposition": "selected", "reason": "Current mature logic, FPGA/server peripherals and memory-control processes. Future photonics is not treated as volume.", "evidence": [ "../packets/umc.json", "../reviews/umc.json" ] }, { "id": "globalfoundries", "functions": [ "specialty-control-power", "optical-interconnect" ], "disposition": "selected", "reason": "Current specialty foundry and Fotonix/AMF capabilities. Future TSMC interposer capacity is not counted as current output.", "evidence": [ "../packets/globalfoundries.json", "../reviews/globalfoundries.json" ] }, { "id": "hua-hong", "functions": [ "specialty-control-power", "memory-wafer-service" ], "disposition": "selected", "reason": "Current embedded memory, analog and power process activity; listed entity used. Huahong Group aggregate not assigned to it.", "evidence": [ "../packets/hua-hong.json", "../reviews/hua-hong.json" ] }, { "id": "intel", "functions": [ "advanced-logic" ], "disposition": "selected-role-representative", "reason": "Current integrated processor manufacturing and current external foundry activity; represents a production role missed by merchant-revenue-only ranking. No boost from internal transfer revenue or future 14A customers.", "evidence": [ "../packets/intel.json", "../reviews/intel.json" ] }, { "id": "tower", "functions": [ "specialty-control-power", "optical-interconnect" ], "disposition": "selected", "reason": "Current optical transceiver and silicon-photonics production; dated issuer revenue and operating results. Unqualified Intel corridor excluded.", "evidence": [ "../packets/tower.json", "../reviews/tower.json" ] }, { "id": "vis", "functions": [ "specialty-control-power" ], "disposition": "selected-cutoff-sensitive", "reason": "Current specialty power/analog role and measured wafer sales. Future VSMC volume and GaN extensions excluded.", "evidence": [ "../packets/vis.json", "../reviews/vis.json" ] }, { "id": "psmc", "functions": [ "memory-wafer-service", "specialty-control-power" ], "disposition": "selected-provisional-role-representative", "reason": "Current merchant memory-wafer activity and complementary mature logic. Represents memory-wafer manufacturing rather than assuming that future PWF/HBM projects are already producing.", "evidence": [ "../packets/psmc.json", "../reviews/psmc.json" ] }, { "id": "nexchip", "functions": [ "specialty-control-power" ], "disposition": "eligible-cutoff-alternative", "reason": "Larger than PSMC in the same external foundry estimate. Current DDIC/CIS production is established; AI-server PMICs and 28nm logic remain in validation in H1. It replaces PSMC if ranking solely by revenue or if memory-wafer representation is not required.", "sourceIds": [ "nexchip-h126", "nexchip-platform", "tf-q226" ] }, { "id": "xfab", "functions": [ "specialty-control-power" ], "disposition": "eligible-cutoff-alternative", "reason": "Current specialty foundry, reported $199.830m Q2. Three SiC data-center design wins are not production volumes; photonics volume expected in 2028. Current revenue cannot resolve its AI-only importance against PSMC/VIS.", "sourceIds": [ "xfab-q226" ] }, { "id": "db-hitek", "functions": [ "specialty-control-power" ], "disposition": "candidate-evidence-gap", "reason": "Issuer discovery identified current AI-data-center power products, but full current release timed out. No current revenue or ordinal rank assigned from search snippets. Must remain a named cutoff alternative, not be scored zero." }, { "id": "silterra", "functions": [ "specialty-control-power", "optical-interconnect" ], "disposition": "eligible-scale-unresolved", "reason": "Current company profile supports merchant CMOS, high-voltage/BCD and photonics capabilities. Comparable production/revenue unavailable; private status is not exclusion.", "sourceIds": [ "silterra-exhibitor" ] }, { "id": "skywater", "functions": [ "specialty-control-power" ], "disposition": "eligible-scale-unresolved", "reason": "July acquisition closed; merchant foundry continues as IonQ subsidiary. Current relevant AI production scale not established; do not use IonQ valuation or quantum orders as AI output.", "sourceIds": [ "skywater-close" ] }, { "id": "lfoundry", "functions": [ "specialty-control-power" ], "disposition": "eligible-scale-unresolved", "reason": "Current 150/110nm specialty technology and foundry services; comparable revenue and AI-specific deployments not established.", "sourceIds": [ "lfoundry-profile" ] }, { "id": "rapidus", "functions": [ "advanced-logic" ], "disposition": "emerging-not-current-commercial", "reason": "Pilot activity and 2027 commercial target; retain researched directory dossier, remove current-production representative slot.", "evidence": [ "../packets/rapidus.json", "../reviews/rapidus.json" ] }, { "id": "samsung-foundry", "functions": [ "advanced-logic" ], "disposition": "alias-folded", "reason": "Operating business of Samsung Electronics; one canonical parent dossier with foundry placement, not second company." }, { "id": "hh-grace", "functions": [ "specialty-control-power" ], "disposition": "consolidated", "reason": "Part of listed Hua Hong; not a separate selected enterprise." }, { "id": "huali-fab5", "functions": [ "specialty-control-power" ], "disposition": "consolidated-after-acquisition", "reason": "Huali Fab5 acquired by listed Hua Hong in September. Q2 boundaries unchanged; future consolidated periods must be updated." }, { "id": "advanced-micro-foundry", "functions": [ "optical-interconnect" ], "disposition": "consolidated", "reason": "Acquired by GlobalFoundries; no additional selected-company slot." }, { "id": "texas-instruments", "functions": [], "disposition": "outside-merchant-scope", "reason": "Integrated analog/power vendor; relevant chip output belongs to chip-design/device supply, not independent merchant foundry service in this comparison." }, { "id": "micron", "functions": [], "disposition": "outside-memory-manufacturer-scope", "reason": "Branded DRAM/NAND manufacturer counted in Memory. Tongluo acquisition alone does not establish merchant logic foundry service." } ], "universeConstruction": "Previous roster and pool, external whole-market foundry research, issuer product/segment disclosures and expanded specialty/private foundry search. The production roles were defined before applying the candidate comparison; explicit cutoff alternatives remain visible.", "observations": [ { "id": "tsmc", "metric": "Foundry revenue", "value": 40200, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "TrendForce foundry revenue estimate; company total includes packaging" }, { "id": "samsung-electronics", "metric": "Foundry revenue", "value": 3260, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Foundry business only; estimate, not Samsung parent or memory revenue" }, { "id": "smic", "metric": "Foundry revenue", "value": 3000, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Release rounds to more than $3bn; exact company consolidated revenue $3,005.588m" }, { "id": "umc", "metric": "Foundry revenue", "value": 2180, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Rounded UMC foundry revenue" }, { "id": "globalfoundries", "metric": "Foundry revenue", "value": 1790, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Rounded estimate; company reported $1,786m" }, { "id": "huahong-group", "metric": "Foundry revenue", "value": 1270, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Huahong Group, NOT interchangeable with the listed Hua Hong Semiconductor entity" }, { "id": "tower", "metric": "Foundry revenue", "value": 460, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Rounded estimate; issuer $460.079m" }, { "id": "vis", "metric": "Foundry revenue", "value": 451, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Rounded USD estimate; issuer Q2 NT$14,245m" }, { "id": "nexchip", "metric": "Foundry revenue", "value": 447, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Foundry estimate; DDIC/CIS dominate; exclude unrelated revenue" }, { "id": "psmc", "metric": "Foundry revenue", "value": 432, "unit": "USD million", "period": "2026 Q2", "classification": "external-estimate", "sourceIds": [ "tf-q226" ], "boundary": "Narrower foundry estimate, NOT whole company NT$17,290.184m" }, { "id": "hua-hong", "metric": "Listed company consolidated revenue", "value": 717.537, "unit": "USD million", "period": "2026 Q2", "classification": "measured-reported", "sourceIds": [ "hua-hong:hh-q2" ], "boundary": "Listed group before September Huali acquisition; not all Huahong Group activities" }, { "id": "intel", "metric": "External foundry revenue", "value": 293, "unit": "USD million", "period": "2026 Q2", "classification": "measured-reported", "sourceIds": [ "intel:i-10q" ], "boundary": "Wafer fabrication plus assembly and test; internal foundry sales excluded" }, { "id": "intel", "metric": "Total Foundry segment revenue including internal", "value": 5765, "unit": "USD million", "period": "2026 Q2", "classification": "measured-reported", "sourceIds": [ "intel:i-10q" ], "boundary": "Diagnostic only. Not a merchant-foundry ranking input." }, { "id": "xfab", "metric": "Consolidated foundry revenue", "value": 199.83, "unit": "USD million", "period": "2026 Q2", "classification": "measured-reported", "sourceIds": [ "xfab-q226" ], "boundary": "Includes $3.852m IFRS15 over-time adjustment; before adjustment $195.979m" }, { "id": "nexchip", "metric": "Consolidated revenue under Chinese Accounting Standards", "value": 5956.67357699, "unit": "CNY million", "period": "2026 H1", "classification": "measured-reported", "sourceIds": [ "nexchip-h126" ], "boundary": "Main business $5,765.8117m CNY; not all consolidated revenue is wafer-foundry revenue. No spot-FX conversion." }, { "id": "nexchip", "metric": "Main-business product composition", "value": { "DDIC": 53.24, "CIS": 25.34, "PMIC": 12.82, "Logic": 4.02, "MCU": 4.25 }, "unit": "percent of main-business revenue", "period": "2026 H1", "classification": "measured-reported", "sourceIds": [ "nexchip-h126" ], "boundary": "Listed categories do not exhaust total. AI-server PMICs under validation; not counted as established AI-server production." }, { "id": "rapidus", "metric": "Commercial production", "value": null, "unit": null, "period": "2026-10-21 review", "classification": "unavailable-not-zero", "sourceIds": [ "rapidus:rp-about" ], "boundary": "2nm pilot evidence; 2027 commercial production target. Financing is not output." } ], "parameters": { "maximumRepresentatives": 10, "globalCompositeWeights": null, "reasonNoComposite": "A weighted sum would turn incompletely comparable revenue, transfer prices and undisclosed AI fractions into invented precision. Revenue and capacity are alternate views, not additive scores.", "roleMinimums": [ { "id": "advanced-logic", "definition": "Current manufacture of advanced processors used for AI training, inference or server computing; internal manufacturing qualifies as a production role but not merchant revenue.", "minimumRepresentatives": 2 }, { "id": "specialty-control-power", "definition": "Current analog, power, mixed-signal, embedded-memory and connectivity processes used around AI processors and servers.", "minimumRepresentatives": 2 }, { "id": "optical-interconnect", "definition": "Current high-speed optical transceiver IC or photonics manufacturing, with production evidence distinct from future pilot announcements.", "minimumRepresentatives": 1 }, { "id": "memory-wafer-service", "definition": "Merchant memory wafer manufacturing and mature logic supporting memory systems, distinct from branded memory-chip sales.", "minimumRepresentatives": 1 } ], "withinRoleOrdering": "Use reported relevant activity where comparable; retain tied or unresolved alternatives where scope differs.", "cutoffTolerance": "Illustrative ±5% and ±10% stress bands on the external estimates. These are declared robustness assumptions, NOT statistical confidence intervals.", "missingTreatment": "Unknown remains null. No zero assignment, funding substitute, disclosure-quality multiplier or parent-revenue fallback.", "globalCoverageThreshold": null, "coverageReason": "No reconciled global production denominator covers merchant services and captive manufacturing. Do not assert 95% AI coverage or divide by the selected-company subtotal." }, "methodsCompared": [ { "method": "Revenue baseline", "fit": "Transparent within comparable merchant scope; misses captive manufacturing and may mis-map group boundaries." }, { "method": "Wafer capacity baseline", "fit": "Physical but 200mm/300mm, qualified output versus installed nameplate, nodes, layer counts, utilization and yield make a pooled number misleading." }, { "method": "Weighted composite", "fit": "Not adopted. No validated empirical weights; double counting revenue and share/capacity would exaggerate scale." }, { "method": "Evidence-qualified role coverage with relevant-activity baseline", "fit": "Recommended for current AI value-chain representation. Measured comparisons retained; role choices and cutoff uncertainty explicit." } ], "selectedCompanyIds": [ "tsmc", "samsung-electronics", "smic", "umc", "globalfoundries", "hua-hong", "intel", "tower", "vis", "psmc" ], "selected": [ { "companyId": "tsmc", "displayOrder": 1, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Largest merchant foundry, current HPC production and broad process portfolio; Q3 issuer results confirm continuing activity." }, { "companyId": "samsung-electronics", "displayOrder": 2, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Foundry operating business retained through the canonical Samsung entity; advanced production and HBM base-die role. Parent revenue is not used." }, { "companyId": "smic", "displayOrder": 3, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Large current manufacturing activity, Chinese advanced and mature processes; restricted access and node interpretation remain in dossier." }, { "companyId": "umc", "displayOrder": 4, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Current mature logic, FPGA/server peripherals and memory-control processes. Future photonics is not treated as volume." }, { "companyId": "globalfoundries", "displayOrder": 5, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Current specialty foundry and Fotonix/AMF capabilities. Future TSMC interposer capacity is not counted as current output." }, { "companyId": "hua-hong", "displayOrder": 6, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Current embedded memory, analog and power process activity; listed entity used. Huahong Group aggregate not assigned to it." }, { "companyId": "intel", "displayOrder": 7, "rankIsNumericallyOrdered": false, "status": "selected-role-representative", "reason": "Current integrated processor manufacturing and current external foundry activity; represents a production role missed by merchant-revenue-only ranking. No boost from internal transfer revenue or future 14A customers." }, { "companyId": "tower", "displayOrder": 8, "rankIsNumericallyOrdered": false, "status": "selected", "reason": "Current optical transceiver and silicon-photonics production; dated issuer revenue and operating results. Unqualified Intel corridor excluded." }, { "companyId": "vis", "displayOrder": 9, "rankIsNumericallyOrdered": false, "status": "selected-cutoff-sensitive", "reason": "Current specialty power/analog role and measured wafer sales. Future VSMC volume and GaN extensions excluded." }, { "companyId": "psmc", "displayOrder": 10, "rankIsNumericallyOrdered": false, "status": "selected-provisional-role-representative", "reason": "Current merchant memory-wafer activity and complementary mature logic. Represents memory-wafer manufacturing rather than assuming that future PWF/HBM projects are already producing." } ], "cutoff": { "provisional": [ "vis", "psmc" ], "alternatives": [ "nexchip", "db-hitek", "xfab", "silterra" ], "interpretation": "The tenth displayed company is a provisional role representative, not a statistically established tenth-largest supplier. DB HiTek and private alternatives require further comparable AI-role evidence before unique ordering is possible.", "entryRule": "A demonstrably current missing function, comparable activity exceeding the cutoff under stated stress bands, or a material ownership/production change triggers reselection; do not churn on tiny quarterly revenue differences." }, "calculations": [ { "formula": "sum(TrendForce rounded revenue observations)", "result": 53490, "unit": "USD million", "meaning": "Rounded top-ten subtotal, not total market" }, { "formula": "40200/0.725", "result": 55448.275862068964, "unit": "USD million", "meaning": "Diagnostic implied broad market from rounded TSMC share; not a confirmed denominator and not used for selection" }, { "formula": "5956.67357699-5765.8117", "result": 190.86187698999947, "unit": "CNY million", "meaning": "Nexchip total less main-business revenue; prevents whole-company substitution" }, { "formula": "5765-293", "result": 5472, "unit": "USD million", "meaning": "Intel segment revenue not external; internal transfer activity excluded from merchant ranking" } ], "cutoffPairwiseSensitivity": [ { "a": "tower", "b": "vis", "ratio": 1.0199556541019956, "minimumSymmetricRelativeBandForOverlap": 0.009879253567508232, "formula": "abs(a-b)/(a+b)" }, { "a": "tower", "b": "nexchip", "ratio": 1.029082774049217, "minimumSymmetricRelativeBandForOverlap": 0.014332965821389196, "formula": "abs(a-b)/(a+b)" }, { "a": "tower", "b": "psmc", "ratio": 1.0648148148148149, "minimumSymmetricRelativeBandForOverlap": 0.03139013452914798, "formula": "abs(a-b)/(a+b)" }, { "a": "vis", "b": "nexchip", "ratio": 1.0089485458612975, "minimumSymmetricRelativeBandForOverlap": 0.004454342984409799, "formula": "abs(a-b)/(a+b)" }, { "a": "vis", "b": "psmc", "ratio": 1.0439814814814814, "minimumSymmetricRelativeBandForOverlap": 0.021517553793884484, "formula": "abs(a-b)/(a+b)" }, { "a": "nexchip", "b": "psmc", "ratio": 1.0347222222222223, "minimumSymmetricRelativeBandForOverlap": 0.017064846416382253, "formula": "abs(a-b)/(a+b)" } ], "sensitivityTests": [ { "case": "Merchant revenue only", "result": [ "tsmc", "samsung-electronics", "smic", "umc", "globalfoundries", "huahong-group", "tower", "vis", "nexchip", "psmc" ], "meaning": "Includes Nexchip and the Huahong Group boundary; excludes Intel and Rapidus. It is a baseline, not the recommended canonical roster." }, { "case": "Remove the memory-wafer function requirement", "result": [ "tsmc", "samsung-electronics", "smic", "umc", "globalfoundries", "hua-hong", "intel", "tower", "vis", "nexchip" ], "meaning": "A deliberate scope change changes the marginal representative. PSMC is not robustly superior to Nexchip on size." }, { "case": "Strict external-wafer comparison only", "result": [ "tsmc", "samsung-electronics", "smic", "umc", "globalfoundries", "hua-hong", "tower", "vis", "psmc", "nexchip" ], "meaning": "Intel internal production is outside this narrower objective. External $293m includes packaging/test and cannot establish comparable pure-wafer rank." }, { "case": "Require independently confirmed current AI-only production volume", "result": null, "meaning": "Most companies lack a comparable AI-only volume; cannot publish a defensible ten-company numerical ranking under this assumption." }, { "case": "±5% estimate perturbation", "result": "All six pairwise intervals among Tower, VIS, Nexchip and PSMC overlap.", "meaning": "Their exact rank order cannot be treated as robust." }, { "case": "±10% estimate perturbation", "result": "Same cutoff cluster overlaps; no manufactured ten-place certainty.", "meaning": "Role coverage and primary commercialization evidence remain the decision basis." }, { "case": "Private or undisclosed activity treated as zero", "result": "Rejected", "meaning": "Would automatically penalize SilTerra and other opaque suppliers. No such imputation used." }, { "case": "Future capacity counted as current", "result": "Rejected", "meaning": "Would improperly promote Rapidus and future VSMC, Intel14A and PSMC projects." } ], "changesVersusPrior": { "prior": [ "tsmc", "smic", "umc", "globalfoundries", "hua-hong", "tower", "vis", "psmc", "samsung-foundry", "rapidus" ], "removed": [ "rapidus" ], "added": [ "intel" ], "aliases": { "samsung-foundry": "samsung-electronics" }, "directoryRetention": [ "rapidus" ], "reason": "Replace future commercial pilot with current integrated production; consolidate Samsung alias." }, "limitations": [ "The representative set is not a total ordering of economic indispensability or expected investment returns.", "Ten slots and minimum role representation are editorial choices; removing a role changes the marginal selection.", "No defensible AI-only worldwide revenue or production denominator is available.", "TrendForce Huahong Group and the listed Hua Hong entity have different reporting boundaries; their figures must not be silently interchanged.", "Nexchip evidence supports a serious cutoff alternative. Its AI-server PMIC production was not established by the H1 filing.", "DB HiTek issuer release retrieval timed out; current discovery remains a research gap. 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"sourceIds": [ "tw-q2-26-gnw" ], "locator": "Statement of operations" }, { "label": "Q2 cash flow", "value": "176.965 operating cash flow; 186.585 investment in property and equipment, net", "unit": "USD million", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "tw-q2-26-gnw" ], "locator": "Cash-flow statement" }, { "label": "Cash and short-term deposits", "value": "231.188 cash; 1,250.225 deposits; 1,481.413 combined", "unit": "USD million", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "tw-q2-26-gnw" ], "locator": "Balance sheet" }, { "label": "Debt, including lease obligations", "value": "141.696: 16.921 current and 124.775 noncurrent", "unit": "USD million", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "tw-q2-26-gnw", "tw-statements25" ], "locator": "Balance sheet; annual liquidity discussion explains included leases" }, { "label": "First-half revenue and attributable profit", "value": "873.710 revenue; 155.801 attributable profit", "unit": "USD million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "tw-q2-26-gnw" ], "locator": "Statement of operations" }, { "label": "Silicon-photonics annualized revenue run rate", "value": "680", "unit": "USD million/year annualized", "period": "Q2 2026 management disclosure; not trailing-year revenue", "asOf": "2026-08-04", "evidence": "company_stated", "sourceIds": [ "tw-q2-26" ], "locator": "CEO statement" }, { "label": "Q3 revenue guidance", "value": "520 ±5%, equivalent to 494–546", "unit": "USD million", "period": "Company forecast issued August 4", "asOf": "2026-08-04", "evidence": "company_stated", "sourceIds": [ "tw-q2-26" ], "locator": "Outlook" }, { "label": "Japan expansion plan", "value": "Approximately 3 billion net company investment after 1 billion of government support", "unit": "USD", "period": "Announced July 2026; future expenditure", "asOf": "2026-07-14", "evidence": "company_stated", "sourceIds": [ "tw-japan" ], "locator": "Investment terms" } ], "calculations": [ { "formula": "231.188+1250.225", "result": 1481.413, "unit": "USD million", "meaning": "Cash plus short-term deposits" }, { "formula": "16.921+124.775", "result": 141.696, "unit": "USD million", "meaning": "Debt balance including issuer-classified lease obligations" }, { "formula": "176.965-186.585", "result": -9.62, "unit": "USD million", "meaning": "Simple Q2 operating cash flow less net PP&E investment, not company-defined adjusted free cash flow" }, { "formula": "520*[0.95,1.05]", "result": [ 494, 546 ], "unit": "USD million", "meaning": "Company Q3 revenue guidance interval" }, { "formula": "90.769-0.150", "result": 90.619, "unit": "USD million", "meaning": "Q2 profit attributable to shareholders plus NCI loss equals consolidated profit" } ] }, "vis": { "path": "chips/packets/vis.json", "sha256": "2a842649d7bb5e4ae01d6ad74ddde9b10f08f9033192edc52bf630db769aeb31", "reviewPath": "chips/reviews/vis.json", "reviewSha256": "3af616bd27476a5ffb049b2e492a81b55ef715712bc29747cd247c981f2d04ce", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Net revenue", "value": "NT$48.59 billion, up 10%; gross margin 28.1%; net income attributable NT$7.9 billion", "unit": "TWD", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "vis-ar25" ], "locator": "2025 Annual Report, Letter to Shareholders; IV.A.1 sales revenue table; retained historical extraction, not independently re-extracted in the current review" }, { "label": "Annual capacity, shipments and utilization", "value": "About 3,434 thousand 8-inch wafers of capacity; 2,532 thousand shipped; utilization 74%", "unit": "8-inch wafers per year", "period": "FY2025", "asOf": "2025-12-31", "evidence": "filing", "sourceIds": [ "vis-ar25" ], "locator": "2025 Annual Report, Letter to Shareholders (Capacity and 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"asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "vis-q226" ], "locator": "Quarterly income statement" }, { "label": "Net income attributable to parent shareholders", "value": "2,975", "unit": "NTD million", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "vis-q226" ], "locator": "Quarterly income statement" }, { "label": "Earnings per share", "value": "1.56", "unit": "NTD", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "vis-q226" ], "locator": "Quarterly income statement" }, { "label": "Wafer shipments and blended selling price", "value": "Shipments +11%; ASP +3%", "unit": "Quarter-on-quarter changes", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "vis-q226" ], "locator": "Release operating discussion" }, { "label": "September sales", "value": "5,903.705", "unit": "NTD million; unaudited", "period": "September 2026", "asOf": "2026-09-30", "evidence": "company_stated", "sourceIds": [ "vis-sep26" ], "locator": "Monthly release; thousands divided by 1,000" }, { "label": "Nine-month sales", "value": "42,478.500", "unit": "NTD million; unaudited", "period": "January–September 2026", "asOf": "2026-09-30", "evidence": "company_stated", "sourceIds": [ "vis-sep26" ], "locator": "Monthly release; thousands divided by 1,000" }, { "label": "VSMC capacity target", "value": "44,000", "unit": "300mm wafers per month; future target", "period": "2029 target", "asOf": "2026-09-28", "evidence": "company_stated", "sourceIds": [ "vsmc-open" ], "locator": "Opening release" }, { "label": "VSMC volume production", "value": "First quarter of 2027", "unit": "Future target; not current commercial output", "period": "Production ramp", "asOf": "2026-09-28", "evidence": "company_stated", "sourceIds": [ "vsmc-open" ], "locator": "Opening release" } ], "calculations": [ { "formula": "5903705 / 1000", "result": 5903.705, "unit": "NTD million", "meaning": "September sales conversion from published thousands" }, { "formula": "42478500 / 1000", "result": 42478.5, "unit": "NTD million", "meaning": "Nine-month sales conversion" }, { "formula": "354709 × 1000", "result": 354709000, "unit": "shares", "meaning": "TSMC retained shares at June 30; source percentage rounded to 19%" } ] }, "psmc": { "path": "chips/packets/psmc.json", "sha256": "f4d1945a485b7a54389c4c19b4c9629963d7be8df17bfa6f886594789f864dda", "reviewPath": "chips/reviews/psmc.json", "reviewSha256": "851a0c935d62e06f40b8eac7194d40c7b063ba45184c49847e2ef13134777128", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "FY2025 revenue and net loss", "value": "46,730.113 revenue; −7,812.660 net result", "unit": "NTD million", "period": "FY2025", "asOf": "2025-12-31", "evidence": "company_stated", "sourceIds": [ "psmc-ar25" ], "locator": "p. 74" }, { "label": "Q2 revenue", "value": "17,290.184", "unit": "NTD million", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Income statement" }, { "label": "Q2 profitability", "value": "4,888.925 gross profit; 3,684.085 operating profit; 3,291.141 net profit", "unit": "NTD million", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Income statement" }, { "label": "Q2 earnings per share", "value": "0.76 basic; 0.75 diluted", "unit": "NTD/share", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Income statement" }, { "label": "H1 revenue and net profit", "value": "30,862.646 revenue; 17,522.350 profit; basic EPS 4.08", "unit": "NTD million, except EPS", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Income statement" }, { "label": "Tongluo disposal gain", "value": "20,236.947", "unit": "NTD million", "period": "March 2026 transaction", "asOf": "2026-03-13", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Note 12; not product revenue" }, { "label": "H1 equipment impairment", "value": "5,508.028", "unit": "NTD million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Notes 12 and 23; non-recurring assessment" }, { "label": "H1 operating cash flow and PP&E purchases", "value": "15,058.597 operating cash flow; 3,356.968 PP&E payments", "unit": "NTD million", "period": "H1 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Cash-flow statement" }, { "label": "Cash balances", "value": "40,117.988 balance-sheet cash; 41,709.651 cash-flow total including 1,591.663 in hedging assets", "unit": "NTD million", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Cash-flow reconciliation" }, { "label": "Borrowings and leases", "value": "27,413.641 borrowings; 2,607.794 lease liabilities separately", "unit": "NTD million", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Balance sheet" }, { "label": "Shares issued and fully paid", "value": "4,711.760", "unit": "million shares, rounded in filing", "period": "June 30, 2026", "asOf": "2026-06-30", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Note 21" }, { "label": "June equity issue", "value": "420 million ordinary shares; USD832.792 million GDR proceeds plus NTD1,687.787 million employee subscriptions", "unit": "Mixed units as reported", "period": "Completed June 12, 2026", "asOf": "2026-06-12", "evidence": "company_stated", "sourceIds": [ "psmc-h1" ], "locator": "Note 21" }, { "label": "September revenue", "value": "7,665.064", "unit": "NTD million, unaudited", "period": "September 2026", "asOf": "2026-09-30", "evidence": "company_stated", "sourceIds": [ "psmc-monthly" ], "locator": "2026 monthly table" }, { "label": "Third-quarter monthly-sales sum", "value": "21,342.792", "unit": "NTD million, calculated; not a quarterly earnings release", "period": "July–September 2026", "asOf": "2026-09-30", "evidence": "inference", "sourceIds": [ "psmc-monthly" ], "locator": "6,668.883 + 7,008.845 + 7,665.064" }, { "label": "Nine-month revenue", "value": "52,205.438", "unit": "NTD million, unaudited", "period": "January–September 2026", "asOf": "2026-09-30", "evidence": "company_stated", "sourceIds": [ "psmc-monthly" ], "locator": "Monthly table sum" }, { "label": "Foundry-market estimate", "value": "432", "unit": "USD million; provider scope differs from consolidated sales", "period": "Q2 2026", "asOf": "2026-06-30", "evidence": "reported", "sourceIds": [ "trendforce-2q26" ], "locator": "September market review" }, { "label": "Issued ordinary shares", "value": "4,712,080,856", "unit": "shares", "period": "Issuer profile output October 20, 2026", "asOf": "2026-10-20", "evidence": "filing", "sourceIds": [ "psmc-t187ap03_L" ], "locator": "Issuer 6770: issued ordinary shares field" } ], "calculations": [ { "formula": "7421.886+5934.792+3933.506", "result": 17290.184, "unit": "NTD million", "meaning": "Q2 product-sales reconciliation" }, { "formula": "2010.517+25403.124", "result": 27413.641, "unit": "NTD million", "meaning": "Borrowings excluding leases" }, { "formula": "620.377+1987.417", "result": 2607.794, "unit": "NTD million", "meaning": "Lease liabilities" }, { "formula": "6668.883+7008.845+7665.064", "result": 21342.792, "unit": "NTD million", "meaning": "Q3 monthly-sales sum" }, { "formula": "17290.184-3933.506", "result": 13356.678, "unit": "NTD million", "meaning": "Excluding memory dies; provider-scope reconciliation hypothesis only" } ] }, "intel": { "path": "chips/packets/intel.json", "sha256": "6f75bf293db2584fe342c5bf55226ad7450ca1209225edf19a99c06b1b6cde54", "reviewPath": "chips/reviews/intel.json", "reviewSha256": "44a03613ecbc882b73ba01b862c957808f0c4cb2d8a91f138423783960882525", "sourceDatesPreserved": true, "keyMetrics": [ { "label": "Revenue", "value": "16,128", "unit": "USD million", "period": "Q2 2026", "asOf": "2026-06-27", "evidence": "filing", "sourceIds": [ "i-10q" ], "locator": "Income statement" }, { "label": "Gross profit and margin", "value": "6,509; 40.4%", "unit": "USD million; percent", "period": "Q2 2026", "asOf": "2026-06-27", "evidence": "filing", "sourceIds": [ "i-10q", "i-q2pr" ], "locator": "Income statement and release" }, { "label": "Operating income", "value": "1,796", "unit": "USD million; GAAP", "period": "Q2 2026", "asOf": "2026-06-27", "evidence": "filing", "sourceIds": [ "i-10q" ], "locator": "Income statement" }, { "label": "Net loss attributable to Intel", "value": "11,033 loss", "unit": "USD million; GAAP", "period": "Q2 2026", "asOf": "2026-06-27", "evidence": "filing", "sourceIds": [ "i-10q" ], "locator": "Income statement; includes government-share 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statement" }, { "label": "Additions to property, plant and equipment", "value": "6,192", "unit": "USD million; gross cash additions", "period": "First six months of 2026", "asOf": "2026-06-27", "evidence": "filing", "sourceIds": [ "i-10q" ], "locator": "Cash-flow statement" }, { "label": "Workforce", "value": "85,100", "unit": "people", "period": "FY2025 year-end", "asOf": "2025-12-27", "evidence": "filing", "sourceIds": [ "i-10k" ], "locator": "Human capital; not an October 2026 headcount" }, { "label": "August equity offering", "value": "210,526,315 shares at $95; approximately $19.67bn expected net proceeds before any option exercise", "unit": "Priced offering; subsequent close not established", "period": "August 2026 prospectus", "asOf": "2026-08-10", "evidence": "filing", "sourceIds": [ "i-final-offering" ], "locator": "Offering terms and expected delivery date" }, { "label": "Intel Products trailing revenue", "value": "53500", "unit": "USD million; derived, not AI-only sales", 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